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HB368F21-6210-S

USD$270

Compact Fanless Embedded System with Intel® J6210 Processor, supports DC-in 12~36V and wide temperature range 20°C ~ 60°C

  • Efficient Processing: Powered by Intel® J6210 SoC Processor (Elkhart Lake, TDP 6.5W)
  • Triple Display Support: Equipped with 3 x DisplayPort outputs supporting 4K resolution
  • Storage & Expansion: 1 x M.2 E-Key, 1 x M.2 M-Key, 1 x M.2 B-Key, and 1 SIM card slot
  • Compact Fanless Design (Only 27mm Height): Supports Wall Mount and DIN Rail for Space-Saving Installation
  • Wide Range DC-In: Supports 12~36V input for versatile power options

shipping to TW will add extra 5% sale tax
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Specifications
Specifications
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SYSTEM
MB FORM FACTOR 3.5″
CPU Onboard Intel® Celeron® Processor N6210 (Formerly Elkhart Lake, TDP 6.5W)
For additional compatible CPUs, please contact regional sales
CHIPSET Intel® SoC
MEMORY 1 x DDR4 3200MHz, Single Channel SO-DIMM, up to 32GB
BIOS AMI Flash ROM
WATCHDOG TIMER 255 Levels
OS SUPPORT Windows® 10 (64bit)
Windows® 11 (64bit)
Linux
POWER
POWER REQUIREMENT DC-in 12~36V
40W Adapter: AC90~240V, DC12V/3.3A
POWER ON MODE AT / ATX (Default) Mode
DISPLAY
GPU Intel® HD Graphics, shared memory
DP 3 x DP (Max Resolution: 4096 x 2160@60Hz)
MULTIPLE DISPLAY Support 3 Displays
LAN
ETHERNET 2 x RJ45 for Realtek® RTL8119I GbE
SYSTEM I/O
REAR PANEL I/O 2 x RJ45
1 x DC12-36V
1 x GND Hold
FRONT PANEL I/O 1 x Power Button
1 x Power LED
4 x USB 2.0
1 x Line-out
1 x MIC-in
1 x Line-in
3 x DP
EXPANSION
M.2 1 x M-key 2242/2280 (PCIe Gen.3×2/SATA interface) Support NVME
1 x E-Key 2230 (USB 2.0/PCIe 3.0 x1)
1 x B-key 3042 (USB3.0 interface)
SIM 1 x SIM Card Slot
MECHANICAL
MOUNTING Wall Mount, DIN Rail Clip
DIMENSIONS (W x D x H) 160.2 (W) x 106.0 (D) x 27.0 (H) mm
GROSS WEIGHT 1.12 kg
NET WEIGHT 0.61 kg
ENVIRONMENT & CERTIFICATION
SHOCK 15G, 11ms duration
VIBRATION 1 Grms/ 5~ 500Hz/ Operation
OPERATING TEMPERATURE -20°C ~ 60°C (-4°F ~ 140°F)
STORAGE TEMPERATURE -40°C ~ 85°C (-40°F ~ 185°F)
OPERATING HUMIDITY 10 ~ 95% @ 40°C, Non-condensing
STORAGE HUMIDITY 0 ~ 95% Relative Humidity, Non-condensing
CERTIFICATION CE/FCC Class A
LVD
ESG DECLARATION EU RoHS
China RoHS
ErP
Packing List
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PART NUMBER DESCRIPTION QTY
HB368F21-6210-S Series HB368F21-6210-S Series 1
HCSFBMWM01B-F WALL MOUNT KITS 1
HCS3XXDINRAILPS-F DIN RAIL KITS 1
L01AS051-F Adapter DC12V_40W 1
Change according to shipping area Power Cord 1
LCSCHBJC3XX-F Screw Pack 1
IO Diagram
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Mechanical
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Note: All specifications are subject to change without notice.